ProPlus Announces v2009.4 Release for Leading-edge Technologies

San Jose, California, January 04, 2010 - ProPlus Design Solutions, Inc. announced its official release of BSIMProPlus v2009.4, its second major release in 2009. This new software supports the latest SPICE models including BSIM4.6.5, BSIMSOI 4.3, HiSIM_HV 1.2.0, PSP 103.1.1 and BSIM-CMG 104.0 beta. To meet increased challenges in process technology advancements, the new release further enhances the AgeMOS reliability modeling flow which is an industry standard solution adopted by many leading foundries for process technologies beyond 65nm. The new software also releases the first complete stress modeling solution for layout proximity effects such as LOD and WPE which have been found to be the key factors causing device variations in advanced CMOS technologies.

The SPICE modeling community has been very active in supporting and improving all advanced device models, aiming to address the ever growing needs arising from the fast-developing process technologies for all kinds of applications. The new release continues the tradition of ProPlus family products which covers the latest public-domain device models, including the most complete modeling solutions for high-voltage devices, the latest MOSFET models for ultra-scaled CMOS technologies, and the unique commercially available solution for multi-gate devices for future-generation technologies. The implementations of these latest models are built in the powerful and easy-to-use BSIMProPlus platform which provides turnkey and interactive solutions for the device model parameter extraction and optimization.

"With the great success in 2009, ProPlus has hit key technology milestones, kept fast growth and achieved its profitability even in the challenging economy environment." said Dr. James Ma, President and CEO of ProPlus Design Solutions, Inc., "As the market leader in the SPICE modeling field for over 15 years, ProPlus serves the largest customer base in the world by building the most experienced R&D team and committing the biggest investment for technology innovations. As a technology leader, ProPlus provides complete modeling solutions for all types of device modeling applications, ranging from very advanced technologies to mainstream technologies and to various specialty technologies such as high-voltage, SOI, TFT, etc. The BSIMProPlus v2009.4 release further solidifies our strongest market position in the SPICE modeling field that we are serving for."

BSIMProPlus software has been the market leader in advanced device modeling in the world. Most of leading semiconductor foundries, IDMs and fabless have been using ProPlus product family as their main modeling tools for many years. They provide the most efficient and accurate SPICE model parameter extraction and optimization, flexible modeling flow customization, powerful model parameter verification and documentation capabilities. Leading semiconductor companies in the world have been using BSIMProPlus tool for all kinds of modeling applications such as CMOS, BiCMOS, bipolar, and TFT processes. BSIMProPlus also controls various commonly-used instrumentations and probe stations for on-wafer and packaged device measurement and characterization.

BSIMProPlus v2009.4 is currently available for evaluation and sale. Please contact local offices of ProPlus Design Solutions Inc. for further information.